VS0019 Micro-Etching Additive

  • VS0019 Micro-Etching Additive
  • VS0019 Micro-Etching Additive
  • VS0019 Micro-Etching Additive
  • VS0019 Micro-Etching Additive
  • VS0019 Micro-Etching Additive
  • VS0019 Micro-Etching Additive
VS0019 Micro-Etching Additive
  • RISE
  • Liaoning, China
  • 3days
  • 50mt / Month

* Strong cleaning power: Delivers powerful stain removal, ensuring cleaner etching results on silicon wafers.
* High compatibility: Suitable for existing HJT and TopCon processes.
* Safe and eco-friendly: No combustion or explosion risks, non-toxic, and requires no special protective measures.

VS0019 Micro-Etching Additive


PRODUCT

INTRODUCTION

VS0019 Micro-Etching Additive is an additive used in the rework processing of photovoltaic silicon wafers. Its primary components include highly effective accelerators and wetting agents, endowing the system with strong oxidation capabilities. It undergoes redox reactions with poly-Si, enhancing the corrosive action of HF. Additionally, VS0019 Micro-Etching Additivereduces surface tension within the system, resulting in superior impurity removal performance.


PRODUCT  CHARACTERISTICS

  •  Strong cleaning power: Delivers powerful stain removal, ensuring cleaner etching results on silicon wafers.

  •  High compatibility: Suitable for existing HJT and TopCon processes.

  •  Safe and eco-friendly: No combustion or explosion risks, non-toxic, and requires no special protective measures.


PRODUCT  PARAMETER


Product Name

Micro-Etching Additive

AppearanceYellow transparent liquid
Relative density1.05-1.15
OdorNearly odorless
pH value (undiluted solution)8.00-11.00
Implementation StandardsQ/SDVS 010


 PRODUCT  APPLICATION

VS0019 Micro-Etching Additive is designed for photovoltaic silicon wafer rework. Its primary components include highly effective accelerators and wetting agents, endowing the system with potent oxidation capabilities. VS0019 Micro-Etching Additive undergoes redox reactions with polycrystalline silicon, enhancing the etching efficacy of hydrofluoric acid. Additionally, it reduces surface tension within the system, thereby achieving exceptional impurity removal performance.


PACKAGING

Packaging Specifications: 10 liters per drum

Shelf Life: Six months when stored sealed in a cool, well-ventilated warehouse.


ABOUT US

VS0019 Micro-Etching Additive

RISE CHELICAM Laos production base is located in Sai Serta Comprehensive Development Zone, Vientiane, Laos, with a building area of 30,000 square meters, is a comprehensive solution provider of wet electronic chemicals and industrial and commercial specialty chemicals, specializing in serving Southeast Asia.

The Laos plant is equipped with advanced production equipment and automated control system, with an annual production capacity of 100,000 tons. The Laos production base adopts advanced purification technology and patented formulation technology, which provides a strong guarantee for the high efficiency and stability of the products. 

Micro-Etching Additive


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